Bioact SC-22 cleans difficult soiling from stencils and electronic circuit assemblies without damaging the environment. It is a popular replacement for isopropyl alcohol (IPA) and other flammable solvents, and is effective in removing uncured surface mount device (SMD) adhesives, raw solder pastes, rosin, no-clean, and water-soluble flux residues.
Based on a proprietary mixture of modified alcohols, Bioact SC-22 offers improved cleaning action of hard-to-shift adhesives and pastes while eliminating the need for a water rinse. It is compatible with appropriate spray-in-air and spray-under immersion application systems and can be applied on all commonly-used electronics substrates.
Bioact SC-22 has no global warming potential and zero ozone depletion potential. It is non-hazardous and is not regulated under NESHAP, SARA, or RCRA legislation. Its components are approved under the US EPA ‘SNAP’ programme.
The product can be used neat (100%) to remove thick film pastes, no-clean flux residues, baked-on rosin, and other difficult adhesives. Greater economy will be found through dilution to 20-30% when tackling more common tasks such as cleaning water-soluble and other flux residues and solder pastes.
