Petroferm’s Hydrex LF is a safer and more environmentally-responsible aqueous cleaner for heated lead-free defluxing and the removal of uncured adhesives from electronics assemblies. It will effectively remove rosin, no-clean and water-soluble flux residues as well as raw solder pastes and uncured Surface Mount Device (SMD) adhesive.
This low-foaming cleaner can be applied as a spray in air, a spray under immersion, or as an ultrasonic cleaning agent. Formulated from a proprietary mixture of solvents, saponifiers, and surfactants, Hydrex LF leaves solder joints bright and is compatible with all commonly used electronics substrate materials.
Hydrex LF has zero ozone depletion potential, zero global warming potential, is non-flammable, and offers no appreciable exposure hazard. Its components are approved under the US EPA Significant New Alternatives Proposal (SNAP).
The range of materials that can be removed with this versatile and effective cleaner is impressive. In addition to lead-free, RMA, OA, and no-clean flux residues it will tackle ionic contamination, solder balls, light oxides, and a wide variety of oils and greases.
