Petroferm’s Hydrex SP-50 is a safer and more environmentally-responsible spray cleaner to remove difficult uncured adhesives and solder pastes from electronics assemblies. This powerful aqueous cleaner is ideally suited to spray application for stencil and misprint cleaning as well as defluxing of circuit boards and assemblies inluding the removal of lead free fluxes.
SP-50 is VOC-free and an effective alternative to traditional ozone-depleting cleaners, and offers low exposure and flammability hazards. It is RoHS-compliant.
Hydrex SP-50 is formulated from a combination of modified alcohols and surfactants and has neutral pH. It removes difficult pastes and adhesives including uncured Surface Mount Device (SMD) adhesives and raw solder pastes as well as rosin, water-soluble and no clean flux residues from electronics assemblies. For less challenging operations where a low odour cleaner is required, Hydrex SP is suggested.
For stencil and misprint cleaning, Hydrex SP-50 is diluted to 10% concentration and applied by the spray-in-air method at 45-55C. Defluxing jobs are by their nature more variable, and SP-50 concentration may be varied from 5-25% and temperatures taken up to 70C as necessary.
Hydrex SP-50 promises excellent compatibility with most common substrate materials.
