Petroferm’s Hydrex WS is a versatile non-flammable alternative to isopropyl alcohol (IPA) for the cleaning of circuit boards and assemblies. It can be applied by ultrasonic immersion or, due to its non-foaming action, as a spray.
Hydrex WS has neutral pH and will remove most solder pastes and uncured surface mount device (SMD) adhesives from misprinted circuit boards and stencils. Any remaining residues can be flushed out in a second immersion with Hydrex WS. It has excellent compatibility with standard substrate materials and stencil carrier sheets.
Despite being formulated from modified alcohols, Hydrex WS is completely non-flammable. The formula is free of surfactants and is suitable in non-water rinsing applications and equipment. Its uses as an IPA replacement are manifold and include the wipe-cleaning of stencil undersides and both open- and closed-loop batch stencil cleaning operations.
Hydrex WS is the environmentally-responsible choice, having no ozone depleting properties and an overall low environmental impact. It is non-flammable and incombustible, and is supplied in ready-to-use form with low odour, high solvency, and high soiling load.
